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revisions ltr description date (yr -mo -da) approved rev sheet rev sheet 15 16 17 18 rev status rev of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by steve l. duncan defense supply center columbus standard microcircuit drawing checked by michael c. jones columbus, ohio 43216 this drawing is available for use by all departments approved by raymond monnin microcircuit, hybrid, memory, digital, flash eprom, 2m x 16-bit and agencies of the department of defense drawing approval date 00-07-18 amsc n/a revision level size a cage code 67268 5962 -97610 sheet 1 of 18 dscc form 2233 apr 97 5962 -e043 -00 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents five product assurance classes, class d (lowest reliability), class e, (exceptions), class g (lowered high reliability), class h (high reliability), and class k, (highest reliability) and a choice of case outlines and lead finishes which are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance levels are reflected in the pin. 1.2 pin . the pin shall be as shown in the following example: 5962 - 97610 01 h x x ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? federal rha device device case lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 radiation hardness assurance (rha) designator . rha marked devices shall meet the mil-prf-38534 specified rha levels and shall be marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function access time 01 wmf2m16-150 flash eprom, 2m x 16-bit 150 ns 02 wmf2m16-120 flash eprom, 2m x 16-bit 120 ns 03 wmf2m16-90 flash eprom, 2m x 16-bit 90 ns 1.2.3 device class designator . this device class designator shall be a single letter identifying the product assurance level as follows: device class device performance documentation d, e, g, h, or k certification and qualification to mil-prf-38534 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style x see figure 1 56 ceramic flatpack, lead formed 1.2.5 lead finish . the lead finish shall be as specified in mil-prf-38534.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings . 1 / supply voltage range (v cc ) 2/ ................................ ......................... -2.0 v dc to +7.0 v dc signal voltage range (any pin except a9) 2 / ................................ ..... -2.0 v dc to +7.0 v dc power dissipation (p d ) ................................ ................................ ..... 0.33 w maximum at 5 mhz storage temperature range ................................ .............................. -65 c to +150 c lead temperature (soldering, 10 seconds) ................................ ....... +300 c data retention ................................ ................................ .................. 10 years minimum endura n ce ( write/erase cycles) ................................ ........................ 10,000 cycles minimum reset, oe, and a9 voltage for auto select and sector protect (v id ): ................................ ................................ ................................ ....... -2.0 v dc to +12.5 v dc 3 / 1.4 recommended operating conditions . supply voltage range (v cc ) ................................ .............................. +4.5 v dc to +5.5 v dc input low voltage range (v il ) ................................ ............................ -0.5 v dc to +0.8 v dc input high voltage range (v ih ) ................................ .......................... +2.0 v dc to v cc + 0.5 v dc case o p erat ing temperature range (t c ) ................................ ............ -5 5 c to +125 c reset, oe, and a9 voltage for auto select and sector protect (v id ): ................................ ................................ ................................ ....... +11.5 v dc to +12.5 v dc 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those listed in the issue of the department of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solitation. specification department of defense mil-prf-38534 - hybrid microcircuits, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1835 - interface standard for microcircuit case outlines. 1 / stresses above the absolute maximum ratings may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. 2 / minimum dc voltage in input or i/o pins is ?0.5 v dc. during voltage transitions, inputs may overshoot v ss to ?2.0 v dc for periods up to 20 ns. maximum dc voltage on output and i/o pins v cc +0.5 v dc. during voltage transitions, outputs may overshoot to v cc +2.0 v dc for periods up to 20 ns. 3 / minimum dc input voltage on reset, oe, and a9 is ?0.5 v dc. during voltage transitions, reset, oe, and a9 may overshoot v ss to ?2.0 v dc for periods up to 20 ns. maximum dc input voltage on a9 is +13.5 v which may overshoot to +14.0 v dc for per iods up to 20 ns.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 4 dscc form 2234 apr 97 handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings (smd's). mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specification, standards, and handbooks are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item performance requirements for device classes d, e, g, h, and k shall be in accordance with mil-prf-38534. compliance with mil-prf-38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as designated for the applicable device class. therefore, the tests and inspections herein may not be performed for the applicable device class (see mil-prf-38534). furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performance requirements as defined in mil-prf-38534 shall be met for the applicable device class. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s) . the case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 2. 3.2.3 truth table(s) . the truth table(s) shall be as specified on figure 3. 3.2.4 timing diagrams . the timing diagram(s) shall be specified on figures 4, 5, and 6. 3.2.5 block diagram . the block diagram shall be as specified on figure 7. 3.2.6 output load circuit . the output load circuit shall be as specified on figure 8. 3.3 electrical performance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are defined in table i. 3.5 programming procedure . the programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.6 marking of device(s) . marking of device(s) shall be in accordance with mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's vendor similar pin may also be marked. 3.7 data . in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group a lot sample, for each device type listed herein. also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 5 dscc form 2234 apr 97 3.8 certificate of compliance . a certificate of compliance shall be required from a manufacturer in order to supply to this drawing. the certificate of compliance (original copy) submitted to dscc-va shall affirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.9 certificate of conformance . a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 endurance . a reprogrammability test shall be completed as part of the vendor?s reliability monitors. this reprogrammability test shall be done for the intial characterization and after any design process changes which may affect the reprogrammability of the device. the methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range. the vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 data retention . a data retention stress test shall be completed as part of the vendor?s reliabilty monitors. this test shall be done for the intial characterization and after any design or process change which may affect data retention. the methods and procedures may be vendor specific, but shall gurantee the number of years listed in section 1.3 herein over the full military temperature range. the vendor?s procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics . t est symbol conditions 1 / 2 / -55 c t c +125 c unless otherwise specified group a subgroups device type limits unit min max dc parameters input leakage current i l i v cc = 5.5 v dc, v in = gnd to v cc 1,2,3 all 10 m a output leakage current i l o v cc = 5.5 v dc, v in = gnd to v cc 1,2,3 all 10 m a v cc active current for read i cc 1 cs = v il , oe = v ih , f = 5 mhz, v cc = 5.5 v dc 1,2,3 all 80 ma v cc active current for program or erase 3 / i cc 2 cs = v il , oe = v ih , v cc = 5.5 v dc 1,2,3 all 120 ma v cc standby current i cc 3 v cc = 5.5 v dc, cs = v ih , f = 5 m hz, reset = v cc 0.3 v 1,2,3 all 0.50 ma input low level 3 / v il 1,2,3 all -0.5 0.8 v input high level 3 / v ih 1,2,3 all 2.0 v cc + 0.5 v v output low voltage v ol v cc = 4.5 v dc, i ol = 12.0 ma 1,2,3 all 0.45 v output high voltage v oh v cc = 4.5 v dc, i oh = -2.5 ma 1,2,3 all 0.85 x v cc v low v cc , lockout voltage v lko 1,2,3 all 3.2 4.2 v dynamic characteristics address capacitance 3 / c ad v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 25 pf output enable 3 / capacitance c oe v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 25 pf see footnotes at end of table.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / 2 / -55 c t c +125 c unless otherwise specified group a subgroups device type limits unit min max dynamic characterisitics - continued write enable 3 / capacitance c we v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 25 pf chip select capacitance 3 / c cs v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 15 pf data i/o capacitance 3 / c i/o v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 15 pf functional testing functional tests see 4.3.1c 7,8a,8b all read cycle ac timing characteristics read cycle time 3 / t rc see figure 4 9,10,11 01 02 03 150 120 90 ns address access time t acc see figure 4 9,10,11 01 02 03 150 120 90 ns chip select access time t c e see figure 4 9,10,11 01 02 03 150 120 90 ns output enable to output valid t oe see figure 4 9,10,11 01 02 03 55 50 40 ns o utp ut hol d from address, cs or oe change, 3 / whichever is first t oh see figure 4 9,10,11 all 0 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / 2 / -55 c t c +125 c unless otherwise specified group a subgroups device type limits un it min max write/erase/ program ac timing characteristics we controlled write cycle time 3 / t wc see figure 5 9,10,11 01 02 03 150 120 90 ns chip select setup time t cs see figure 5 9,10,11 all 0 ns 01,02 50 write enable pulse width t wp see figure 5 9,10,11 03 45 ns address setup time t as see figure 5 9,10,11 all 0 ns 01,02 50 data setup time t ds see figure 5 9,10,11 03 45 ns data hold time t dh see figure 5 9,10,11 all 0 ns 01,02 50 address hold time t ah see figure 5 9,10,11 03 45 ns write enable pulse width 3 / high t wp h see figure 5 9,10,11 all 20 ns write/erase/program ac timing characteristics cs controlled write cycle time 3 / t wc see figure 6 9,10,11 01 02 03 150 120 90 ns write enable setup time t ws see figure 6 9,10,11 all 0 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 9 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / 2 / -55 c t c +125 c unless otherwise specified group a subgroups device type limits unit min max write/erase/ program ac timing characteristics cs controlled - continued 01,02 50 chip select pulse width t cp see figure 6 9,10,11 03 45 ns address setup time t as see figure 6 9,10,11 all 0 ns data hold time t dh see figure 6 9,10,11 all 0 ns 01,02 50 data setup time t ds see figure 6 9,10,11 03 45 ns 01,02 50 address hold time t ah see figure 6 9,10,11 03 45 ns chip select pulse width 3 / high t cph see figure 6 9,10,11 all 20 ns 1 / unless otherwise specifi ed, 4.5 v dc v cc 5.5 v dc and v ss = 0 v. 2 / unless otherwise specified, the dc test conditions are as follows: input pulse levels: v ih = v cc - 0.3 v and v il = 0.3 v. unless otherwise specified, the ac test conditions are as follows: input pulse levels: v il = 0 v and v ih = 3.0 v. input rise and fall times: 5 nanoseconds. input and output timing reference levels: 1.5 v. 3 / parameters shall be tested as part of device characterization and after design and process changes. parameters shall be guaranteed to the limits specified in table i for all lots not specifically tested.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 10 dscc form 2234 apr 97 figure 1. case outline .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 11 dscc form 2234 apr 97 symbol millimeters inches min max min max a 4.06 .160 a2 0.38 0.64 .033 .047 b 0.20 0.30 .008 .012 c 0.13 0.23 .006 .010 c1 0 -4 0 -4 c2 0.51 typ .020 typ d 23.37 23.88 .920 .940 d2 21.59 typ .850 typ e 12.80 13.11 .504 .516 e1 16.00 16.26 .630 .640 e 0.80 typ .315 typ l 1.58 typ .063 typ r 0.18 typ .007 typ notes: 1. the u.s preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. figure 1. case outline(s) ? continued.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 12 dscc form 2234 apr 97 device types all device types all device types all device types all case outline x case outline x case outline x case outline x terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 cs a12 a13 a14 a15 nc cs2 nc a20 a19 a18 a17 a16 v cc gnd i/o6 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 i/o14 i/o7 i/o15 ry/by oe we nc i/o13 i/o5 i/o12 i/o4 v cc gnd i/o11 i/o3 i/o10 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 i/o2 nc nc nc a0 i/o0 i/o8 i/o1 i/o9 v cc a8 gnd a7 a6 a5 a4 49 50 51 52 53 54 55 56 a3 a2 a1 a9 a10 a11 reset nc note: nc is a no connection figure 2. terminal connections .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 13 dscc form 2234 apr 97 cs oe we i/o mode v il v il v ih d out read v il v ih v il d in write v ih x x high z standby v il v ih v ih high z output disable notes: 1. v ih = high logic level 2. v il = low logic level 3. x = do not care (either high or low) 4. high z = high impedance state figure 3. truth table . figure 4. read cycle timing diagram .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 14 dscc form 2234 apr 97 figure 5. write cycle timing diagram, we controlled . figure 6. write cycle timing diagram, cs controlled .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 15 dscc form 2234 apr 97 figure 7. block diagram .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 16 dscc form 2234 apr 97 parameter typ. unit input pulse level v il = 0 v, v ih = 3.0 v v input rise and fall 5 ns input and output reference level 1.5 v timing reference level 1.5 v notes: 1. v z is programmable from +2 v to +7 v. 2. i ol and i oh are programmable from 0 to 16 ma. 3. teste r impedance is z 0 = 75 ohms. 4. v z is typically the midpoint of v ol and v oh . 5. i ol and i oh are adjusted to simulate a typical resistive load circuit. 6. ate tester includes jig capacitance. figure 8. output load circuit .
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 17 dscc form 2234 apr 97 table ii. electrical test requirements . mil-prf-38534 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters 1,4,7,9 final electrical parameters 1*, 2,3,4,7,8a,8b,9,10,11 group a test requirements 1,2,3,4,7,8a,8b,9,10,11 group c end-point electrical parameters 1,2,3,4,7,8a,8b,9,10,11 end-point electrical parameters for radiation hardness assurance (rha) devices not applicable * pda applies to subgroup 1. 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 4.2 screening . screening shall be in accordance with mil-prf-38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. (2) t a as specified in accordance with table i of method 1015 of mil-std-883. b. interim and final electrical test parameters shall be as spe cified in table ii herein, except interim electrical parameter tests prior to burn -in are optional at the discretion of the manufacturer. 4.3 conformance and periodic inspections . conformance inspection (ci) and periodic inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein. 4.3.1 group a inspection (ci) . group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests shall be as specified in table ii herein. b. subgroups 5 and 6 shall be omitted. c. subgroups 7 and 8 shall include verification of the truth table on figure 3.
standard microcircuit drawing size a 5962-97610 defense supply center columbus columbus, ohio 43216-5000 revision level sheet 18 dscc form 2234 apr 97 4.3.2 group b inspection (pi) . group b inspection shall be in accordance with mil-prf-38534. 4.3.3 group c inspection (pi) . group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. steady-state life test, method 1005 of mil-std-883. (1) test condition a, b, c, or d. the test circuit shall be maintained by the manufact urer under document revision level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a as specified in accordance with table i of method 1005 of mil-std-883. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.3.4 group d inspection (pi) . group d inspection shall be in accordance with mil-prf-38534. 4.3.5 radiation hardness assurance (rha) inspection . rha inspection is not currently applicable to this drawing. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38534. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor- prepared specification or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated as specified in mil-prf- 38534. 6.4 record of users . military and industrial users shall inform defense supply center columbus when a system application requires configuration control and the applicable smd. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43216-5000, or telephone (614) 692-0512. 6.6 sources of supply . sources of supply are listed in mil-hdbk-103 and qml-38534. the vendors listed in mil-hdbk- 103 and qml-38534 have submitted a certificate of compliance (see 3.8 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 00-07-18 approved sources of supply for smd 5962-97610 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38534 during the next revisions. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dscc-va. this bulletin is superseded by the next dated revisions of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9761001hxa 5962-9761001hxc 54230 54230 wmf2m16-150daq5 wmf2m16-150daq5 5962-9761002HXA 5962-9761002hxc 54230 54230 wmf2m16-120daq5 wmf2m16-120daq5 5962-9761003hxa 5962-9761003hxc 54230 54230 wmf2m16-90daq5 wmf2m16-90daq5 1 / the lead finish shown for each pin representing a hermetic package is the most readily availab le from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the perfo rmance requirements of this drawing. vendor cage vendor name number and address 54230 white electronic designs corporation 3601 east university drive. phoenix, az 85034 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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